Intel CEO on the disastrous impact of sanctions – up to 7nm, not even a step further
China’s semiconductor industry is suffering severely under technological sanctions, the Intel CEO confirmed during the opening speech at the World Economic Forum in Davos. US sanctions targeting key components for chip manufacturing are long-term and have systemic repercussions for China’s semiconductor industry. In a word, they are able to produce 14 nm and 7 nm chips with what they currently have, and very soon they will be a decade behind the leading companies in this field.
By joining forces, America, together with Japan and the Netherlands, manages to greatly limit the progress of the Chinese semiconductor industry in key areas, causing systemic damage in the field of developing advanced solutions in the long term, the consequences of which will only be felt in the coming period.
Intel claims that China is 10 years behind
On the other hand, companies: TSMC, Samsung and Intel are preparing to conquer even more advanced 3 nm, 2 nm and even more sophisticated semiconductor manufacturing processes over the next few years.
TSMC 2 nm chipsets are expected to be used in the Apple iPhone 17 line of phones that will be launched in 2025, reports mydrivers.
According to Gelsinger, decades of industrial policy efforts have now resulted in concentrated chip production in Asian countries, and the United States is currently trying to reverse this trend through the Chip Act. Its goal is to increase the technological self-sufficiency of American industry.
The U.S. believes it could begin manufacturing state-of-the-art chips and processors within the current decade. On the other hand, the Nvidia CEO believes that such a step takes at least 10 to 20 years.