The MediaTek Dimensity 8300 chip seems to arrive straight from the 4 nm manufacturing process
The new mobile processor of the Taiwanese company MediaTek, the Dimensity 8300 chip should appear on November 21, and before its launch comes insider information revealing its alleged specifications. A well-known Weibo account, Digital Chat Station claims that it will be based on TSMC’s 4 nm manufacturing process and will have a 1+3+4 configuration.
More precisely, this means that this processor will have one large Cortex-A715 core running at 3.35 GHz, three additional P-cores of the same type running at 3.32 GHz and four small, energy-efficient Cortex-A510 cores with with a frequency of 2.2 GHz. On the graphics side, it will reportedly be supported by the Mali-G615 MC6 GPU.
The 4+4 architecture is similar to the Dimensity 8200 chipset, where four Cortex-A715 cores handle most high-performance tasks, while four Cortex-A510 cores are focused on efficiency.
The Dimensity 8300 has been spotted in the Geekbench 6 listing of a Redmi phone, which is likely part of the upcoming K70 series. The phone, identified as the Xiaomi 2311DRK48C model, achieved a single-core score of 1512 and a multi-core score of 4886 points, putting it slightly ahead of the Dimensity 8200 and 8200-Ultra chipsets.
According to the leaked information, the performance of the Dimensity 8300 chip will surpass the Qualcomm Snapdragon 7+ Gen 2 SoC. Of course, details about the capabilities and performance of the Dimensity 8300 will be available at the official launch on November 21.