The Dimensity 9400 SoC on the advanced second-generation TSMC 3nm technology is coming
Fresh leaks from MediaTek’s system-on-a-chip (SoC) research and development section indicate that Dimensity 9400successor Dimensity 9300 chipset, is already out of the development phase. Digital Chat Station, a trusted source with a long history of accurate information, he shared early insights on its Weibo micro-blog, hinting at the arrival of the next generation of Mediatek’s premium chip, it writes TechPowerUp. The chip is reportedly entering mass production in TSMC plantsusing the factory’s highly anticipated second-generation 3nm process.
MediaTek introduced Dimensity 9300 as its current flagship mobile processor as recently as last November. However, the rapid dynamics of technological progress in the field of semiconductor components is evident considering the news about the development of its successor.
The All Big Core configuration should remain present in the Dimensity 9400 as well
Dimensity 9300, known for its characteristic “All Big Core design”, it does not have less efficient cores. It is built on TSMC’s third-generation 4nm process, with four ARM Cortex-X4 cores clocked up to 3.25 GHz and four Cortex-A720 cores with a maximum frequency of 2.0 GHz.
According to information from Digital Chat Station, the All Big Core configuration should remain present in the Dimensity 9400, but with significant improvements. It is claimed that hardware engineers from MediaTek have selected the latest CPU and GPU designs from ARM, with the Cortex-X5 core possibly being one of the key elements.
TSMCThis fits with speculation about upcoming high-end SoCs from competitors such as Exynos and Snapdragon, which are expected to adopt ARM’s fifth-generation designs.
Industry experts suggest that both MediaTek and Qualcomm are considering TSMC’s N3E process for their upcoming flagship chipsets. This process is believed to provide “improved economy and superior yield” compared to the first-generation N3B process, which Apple used for its M and B-series SoCs.
In what promises to be fierce competition, the Dimensity 9400 is expected to toe the line Qualcomm’s Snapdragon 8 Gen 4 chipset. The latter should appear with custom Oryon cores, adding an extra layer of complexity to the battle for supremacy in the mobile processor industry.
If MediaTek’s Dimensity 9400 can deliver competitive performance, it may find favor with smartphone makers looking for a high-performance chipset for their future devices. As the race for technological superiority intensifies, consumers can expect an exciting era of innovation and improved capabilities in the field of mobile processors, and thus a significant improvement of new generations of smartphones.