Samsung is preparing the Exynos 2400 with the revolutionary FOWLP Technology for the Galaxy S24 series
Significant evolution awaits consumers as Samsung is again trying to restore customer confidence in its Exynos chipset by introducing the long-awaited Exynos 2400 into standard versions Galaxy S24 i Galaxy S24 Plus devices in selected regions.
The focus on this chipset has increased since it is South Korean EDaily recently revealed a revolutionary leap in Exynos 2400 technology – the introduction of Fan-out Wafer-level Packaging (FOWLP). This marks a significant moment in semiconductor chip packaging, pushing Samsung into a new era of innovation. The Exynos 2400 will lead the way as a pioneer in the application of this advanced packaging technology in the Galaxy S24 and Galaxy S24 Plus.
The Exynos 2400 chipset promises additional layers of innovation
Fan-out Wafer-level Packaging (FOWLP) is touted as a key technology that improves the performance of semiconductor chips, positioning Samsung as a dangerous competitor to industry leaders like TSMC.
Deviating from traditional chip packaging methods that involve bonding chips to a printed circuit board (PCB), FOWLP eliminates the need for a PCB. This direct connection to the wafer results in a 40% chip reduction, a 30% thickness reduction, and a 15% performance increase compared to the prevailing FC-BGA (Flip Chip-Ball Grid Array) technology.
The launch date is eagerly awaited by the tech community Galaxy S24 series. Samsung’s strategic integration of FOWLP technology and the powerful Exynos 2400 chipset promises additional layers of innovation in the smartphone industry.
The question on every mind – will Samsung finally overtake the Snapdragon 8 series this time around? The answers remain hidden for some time yet, urging enthusiasts to stay tuned for what is expected to be a revolutionary release in the dynamic world of smartphones.
The question that remains is why Samsung, if all this is true, does not install this chipset in the Galaxy S24 Ultra smartphone? We will still be satisfied with Snapdragon 8 Gen 3 with custom chipset.