MediaTek has quietly changed the names of its Dimensity chipsets, and we’ve ranked them for you
The rebranding of the Mediatek Dimensity chipsets has led to less confusion for users who keep track of the new phones that seem to be popping up ever so often. To simplify things, we’ll try to separate the Dimensity chipsets into three classes: A, B and C and count them for you.
This class includes 11 chipsets, according to the classification and AnTuTu test results published by the GizmoChina website.
| MediaTek SoC | Performance CPU core | Efficient CPU cores | GPU | Production process |
| Dimensity 6020 (bivši Dimensity 700) | 2x ARM Cortex A76 | 6x ARM Cortex A55 | Mali-G57 MC2 | TSMC 7 nm |
| Dimensions 720 | 2x ARM Cortex A76 | 6x ARM Cortex A55 | Mali-G57 MC2 | TSMC 7 nm |
| Dimensity 800U | 2x ARM Cortex A76 | 6x ARM Cortex A55 | Mali-G57 MC3 | TSMC 7 nm |
| Dimensity 6080 (bivši Dimensity 810) | 2x ARM Cortex A76 | 6x ARM Cortex A55 | Mali-G57 MC2 | TSMC 6 nm |
| Dimensity 6100+ (Dimensity 810 with lower operating cycles) | 2x ARM Cortex A76 | 6x ARM Cortex A55 | Mali-G57 MC2 | TSMC 6 nm |
| Dimensity 900 | 2x ARM Cortex A78 | 6x ARM Cortex A55 | Mali-G68 MC4 | TSMC 6 nm |
| Dimensions 920 | 2x ARM Cortex A78 | 6x ARM Cortex A55 | Mali-G68 MC4 | TSMC 6 nm |
| Dimensity 7020 (bivši Dimensity 930) | 2x ARM Cortex A78 | 6x ARM Cortex A55 | IMG BXM-8-256 | TSMC 6 nm |
| Dimensity 7030 (bivši Dimensity 1050) | 2x ARM Cortex A78 | 6x ARM Cortex A55 | Mali-G610 MC3 | TSMC 6 nm |
| Dimensity 7050 (bivši Dimensity 1080) | 2x ARM Cortex A78 | 6x ARM Cortex A55 | Mali-G68 MC4 | TSMC 6 nm |
| Dimensity 7200 (i 7200 Ultra) | 2x ARM Cortex A715 | 6x ARM Cortex A510 | Mali-G610 MC4 | TSMC 4 nm |
The classification is primarily based on AnTuTu tests, but it is clear that the lowest class of Dimensity chipsets has two performance and six efficient cores, which certainly affects performance. This means less performance in games and slower opening and operation in demanding applications.
If you want to roughly compare your performance, this class of Dimensity chipsets, depending on the model, has between 380 and 550 thousand points in AnTuTu tests. The only exception is the new Dimensity 7200 which is built in the new TSMC 4 nm manufacturing process and uses Cortex A715 and A510 versus A78 and A76 cores and scores almost 740,000 points in the AnTuTu test.
It should also be noted that MediaTek changed the name of the Dimensity 810 chipset to Dimensity 6080, which will be found in the recently announced Redmi Note 13 phone. We mention this because the Dimensity 810 was introduced in 2021, and today it appears under a new name, in the hope that few people will notice that it is the chipset from the Redmi Note 11 phone.
This class represents the so-called golden mean, because you get enough powerful and capable performance for virtually any task you can think of, but which are still not at the flagship level. They have a 4+4 core layout and nine-core Mali G77 graphics chips, which means much more serious gaming performance than the B-class.
| MediaTek SoC | Performance CPU core | Efficient CPU cores | GPU | Production process |
| Dimensity 1000 (and 1000+ versions) | 4x ARM Cortex A77 | 4x ARM Cortex A55 | Mali-G77 MC9 | TSMC 7 nm |
| Dimensity 8020 (bivši Dimensity 1100) | 4x ARM Cortex A78 | 4x ARM Cortex A55 | Mali-G77 MC9 | TSMC 6 nm |
| Dimensity 1200 (and 1200 Ultra version) | 4x ARM Cortex A78 | 4x ARM Cortex A55 | Mali-G77 MC9 | TSMC 6 nm |
| Dimensity 8050 (bivši Dimensity 1300) | 4x ARM Cortex A78 | 4x ARM Cortex A55 | Mali-G77 MC9 | TSMC 6 nm |
In addition, this class has an excellent price-performance ratio and is therefore a favorite choice of budget-oriented phones such as the Xiaomi 11T for example. As for AnTuTu numbers, you can expect between 515 and 715 thousand points.
The highest class of MediaTek Dimensity chipsets is intended for high performance, but also economical operation, so that the phones that use them have good battery autonomy.
| MediaTek SoC | Performance CPU core | Efficient CPU cores | GPU | Production process |
| Dimensity 8000 | 4x ARM Cortex A78 | 4x ARM Cortex A55 | Mali-G610 MC6 | TSMC 5 nm |
| Dimensity 8100 (i 8100 Ultra) | 4x ARM Cortex A78 | 4x ARM Cortex A55 | Mali-G610 MC6 | TSMC 5 nm |
| Dimensity 8200 (i 8200 Ultra) | 4x ARM Cortex A78 | 4x ARM Cortex A55 | Mali-G610 MC6 | TSMC 4 nm |
| Dimensity 9000 (i 9000+) | 1x ARM Cortex X2, 3x Cortex A710 | 4x ARM Cortex A510 | Mali-G710 MC10 | TSMC 4 nm |
| Dimensity 9200 (i 9200+) | 1x ARM Cortex X3, 3x Cortex A715 | 4x ARM Cortex A510 | Evil-G715-Immortal MC11 | TSMC 4 nm |
Besides the 4+4 core arrangement, as with the B class, it is much more important that these chipsets are made in 5 nm and 4 nm production processes. This initially means better performance (from 835 thousand to 1.2 million points), at the same time with lower consumption, which ensures that the device does not overheat.
We should not forget that chipsets such as Dimensity 9200, as for example Vivo X90 Pro and Xiaomi 13T Pro guarantee performance in the class with the best Snapdragon chipsets in all spheres, including demanding games.
A clearer picture
We hope that the picture of Dimensity chipsets is now a little clearer than it was, and that you know what you can expect from the new, as well as the new-old chipsets, which are becoming more and more popular in new phones.